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Typical Electrical Characteristics (continued)
7
30
S(O
LIM
1m
6
5
V DS = 5.0V
T J = -55°C
25°C
125°C
10
5
3
RD
N)
IT
100
s
us
4
1
10m
s
3
2
0.3
0.1
V GS = 4.5V
SINGLE PULSE
10
1s
DC
0m
s
1
0.03
R θ JA =See Note1b
T A = 25°C
0
0
2
4
6
8
10
0.01
0.1
0.2
0.5
1
2
5
10
20 30
50
I D , DRAIN CURRENT (A)
Figure 13. Transconductance Variation with Drain
Current and Temperature .
V , DRAI N-SOURCE VOLTAGE (V)
DS
Figure 14. Maximum Safe Operating Area .
1
0.8
0.6
0.4
1b
1a
2
1.8
1.6
1a
T A = 25 C
0.2
4.5"x5" FR-4 Board
1.4
1b
4.5"x5" FR-4 Board
o
Still Air
T A = 25 C
Still Air
o
V GS = 4.5V
0
0
0.1
0.2
0.3
0.4
1.2
0
0.1
0.2
0.3
0.4
2oz COPPER MOUNTING PAD AREA (in )
2
Figue 15. SuperSOT TM _ 3 Maximum
Steady-State Power Dissipation versus Copper
Mounting Pad Area.
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 16. Maximum Steady-State Drain
Current versus Copper Mounting Pad Area .
0.5
D = 0.5
0.2
0.1
0.05
0.2
0.1
0.05
R θ JA (t) = r(t) * R θ JA
R θ JA = See Note 1b
P(pk)
0.02
0.01
0.02
0.01
t 1
t 2
0.005
Single Pulse
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 /t 2
0.002
0.001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal response will
change depending on the circuit board design.
NDS355AN Rev.C
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